Row: 2 - 8 GB PC4-19200 DDR4 SDRAM SK Hynix HMA81GS6AFR8N-UH --------------
[General Module Information]
Module Number: 2
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: SO-DIMM
Memory Speed: 1200.5 MHz (DDR4-2400 / PC4-19200)
Module Manufacturer: SK Hynix
Module Part Number: HMA81GS6AFR8N-UH
Module Revision: 0.0
Module Serial Number: 4237076912
Module Manufacturing Date: Year: 2018, Week: 10
Module Manufacturing Location: 1
SDRAM Manufacturer: SK Hynix
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.1 MHz: 15-15-15-35
Supported Module Timing at 1000.0 MHz: 14-14-14-32
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 866.7 MHz: 12-12-12-28
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 733.3 MHz: 11-11-11-24
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.300 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Standard
